Invention Grant
- Patent Title: Photomask and method of fabricating a photomask
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Application No.: US15967159Application Date: 2018-04-30
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Publication No.: US11435660B2Publication Date: 2022-09-06
- Inventor: Hsin-Chang Lee , Ping-Hsun Lin , Yen-Cheng Ho , Chih-Cheng Lin , Chia-Jen Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F1/52 ; G03F1/68 ; G03F1/54 ; G03F1/26

Abstract:
A method of fabricating a photomask includes selectively exposing portions of a photomask blank to radiation to change an optical property of the portions of the photomask blank exposed to the radiation, thereby forming a pattern of exposed portions of the photomask blank and unexposed portions of the photomask blank. The pattern corresponds to a pattern of semiconductor device features.
Public/Granted literature
- US20190155140A1 PHOTOMASK AND METHOD OF FABRICATING A PHOTOMASK Public/Granted day:2019-05-23
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