Invention Grant
- Patent Title: Chip dismounting and mounting device
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Application No.: US15878724Application Date: 2018-01-24
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Publication No.: US11435694B2Publication Date: 2022-09-06
- Inventor: Peng Jiang , Liangliang Hu
- Applicant: Jiangxi YiBo E-TECH Co., Ltd.
- Applicant Address: CN Xinyu
- Assignee: Jiangxi YiBo E-TECH Co., Ltd.
- Current Assignee: Jiangxi YiBo E-TECH Co., Ltd.
- Current Assignee Address: CN Xinyu
- Agency: FisherBroyles LLP
- Agent Kevin D. Jablonski
- Priority: CN201720468076.6 20170429,CN201720690517.7 20170614,CN201721087979.6 20170829
- Main IPC: G03G21/18
- IPC: G03G21/18 ; F16B3/00 ; F16B2/24

Abstract:
A chip dismounting and mounting device, matched with a chip mounting part on a process cartridge. The chip dismounting and mounting device is capable of dismounting a chip disposed on the chip mounting part or mounting the chip on the chip mounting part. The chip dismounting and mounting device can smoothly dismount the chip on an exhausted process cartridge without damage and smoothly mount the dismounted chip on a new process cartridge. This alleviates the inconvenience for the user to dismount a chip on the exhausted process cartridge and mount the chip on the new process cartridge.
Public/Granted literature
- US20180314203A1 CHIP DISMOUNTING AND MOUNTING DEVICE Public/Granted day:2018-11-01
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