Invention Grant
- Patent Title: Semiconductor integrated circuit and operation method thereof
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Application No.: US16734844Application Date: 2020-01-06
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Publication No.: US11436176B2Publication Date: 2022-09-06
- Inventor: Kyungsoo Lee , Jaewon Lee , Junho Huh , Helin Lin
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0009830 20190125
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F9/4401 ; G06F13/24 ; G06F13/42

Abstract:
A semiconductor integrated circuit includes a central processing unit, a hardware function block that outputs a plurality of hardware signals to be transmitted to an external device independently of the central processing unit, a virtual general purpose input/output (GPIO) finite state machine that transforms the plurality of hardware signals to a virtual GPIO payload, and an I3C communication block that transmits the virtual GPIO payload to the external device through a serial data line and a serial clock line.
Public/Granted literature
- US20200242066A1 SEMICONDUCTOR INTEGRATED CIRCUIT AND OPERATION METHOD THEREOF Public/Granted day:2020-07-30
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