Invention Grant
- Patent Title: Coil component
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Application No.: US16008584Application Date: 2018-06-14
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Publication No.: US11437173B2Publication Date: 2022-09-06
- Inventor: Jae Hun Kim , Seong Min Cho , Eo Jin Choi , Young Ku Lyu , Yong Hui Li
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0113142 20170905
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F17/00 ; H01F17/04 ; H01F27/28 ; H01F27/29 ; H01F27/32

Abstract:
A coil component includes a body, a coil portion embedded in the body, and external electrodes electrically connected to the coil portion. The coil portion includes coil patterns having trenches formed in surfaces thereof. The trenches extend through a partial thickness of the coil portion, and are located at aligned locations in adjacent windings of the coil portion. A method of forming the coil component includes forming a mask pattern having a coil shaped opening and including a plurality of bridges extending across the coil shaped opening in the mask pattern.
Public/Granted literature
- US20190074126A1 COIL COMPONENT Public/Granted day:2019-03-07
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