Invention Grant
- Patent Title: Coil electronic component
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Application No.: US16534231Application Date: 2019-08-07
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Publication No.: US11437180B2Publication Date: 2022-09-06
- Inventor: Yong Hui Li , Byung Soo Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0053091 20190507
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F17/00 ; H01F27/29

Abstract:
A coil electronic component includes a body having a first surface and a second surface, opposing each other, and a third surface connecting the first surface and the second surface to each other, an insulating substrate disposed inside the body, a coil portion disposed on the insulating substrate, a first lead-out portion extending from one end portion of the coil portion and having a first spaced portion and a second spaced portion separate from each other by a first slit, whereby the first and second spaced portions are respectively exposed to the first surface and the third surface of the body, and a second lead-out portion extending from the other end portion of the coil portion and having a third spaced portion and a fourth spaced portion separate from each other by a second slit, whereby the third and fourth spaced portions are respectively exposed to the second surface and a third surface of the body.
Information query