Invention Grant
- Patent Title: Ceramic electronic component and method of manufacturing ceramic electronic component
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Application No.: US17068872Application Date: 2020-10-13
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Publication No.: US11437191B2Publication Date: 2022-09-06
- Inventor: Kenichi Hayashi , Takiji Kitagawa , Hiroaki Hata , Yuji Muranaka
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-194820 20191025
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G13/00 ; H01G4/30 ; H01G4/248

Abstract:
A ceramic electronic component includes a ceramic body including an internal electrode therein and at least two external electrodes provided on an outer surface of the ceramic body. The external electrode includes an underlying electrode layer provided on the outer surface of the ceramic body, a first Ni plated layer provided on an outer side of the underlying electrode layer, and a second Ni plated layer provided on an outer side of the first Ni plated layer. Ni oxide is present between the first Ni plated layer and the second Ni plated layer.
Public/Granted literature
- US20210125780A1 CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT Public/Granted day:2021-04-29
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