Invention Grant
- Patent Title: Stage and plasma processing apparatus
-
Application No.: US16905470Application Date: 2020-06-18
-
Publication No.: US11437223B2Publication Date: 2022-09-06
- Inventor: Yasuharu Sasaki , Tsuguto Sugawara , Shin Yamaguchi , Hajime Tamura
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Weihrouch IP
- Priority: JPJP2019-113066 20190618
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683

Abstract:
A stage includes an electrostatic chuck that supports a substrate and an edge ring; and a base that supports the electrostatic chuck. The electrostatic chuck includes a first region having a first upper surface and supports the substrate placed on the first upper surface; a second region having a second upper surface, provided integrally around the first region, and supports the edge ring placed on the second upper surface; a first electrode provided in the first region to apply a DC voltage; a second electrode provided in the second region to apply a DC voltage, and a third electrode to apply a bias power.
Information query