Invention Grant
- Patent Title: Sequencer time leaping execution
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Application No.: US16911244Application Date: 2020-06-24
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Publication No.: US11437254B2Publication Date: 2022-09-06
- Inventor: Chongyang Wang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G05B19/418

Abstract:
A method includes receiving a plurality of operations in a sequence recipe. The plurality of operations are associated with processing a plurality of substrates in a substrate processing system. The method further includes identifying a plurality of completion times corresponding to the plurality of operations. Each completion time of the plurality of completion times corresponds to completion of a respective operation of the plurality of operations. The method further includes simulating the plurality of operations by setting a virtual time axis to each of the plurality of completion times to generate a schedule for the sequence recipe. The method further includes causing, based on the schedule, the plurality of substrates to be processed or performance of a corrective action.
Public/Granted literature
- US20210405626A1 SEQUENCER TIME LEAPING EXECUTION Public/Granted day:2021-12-30
Information query
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