Invention Grant
- Patent Title: Robot hand, wafer transfer robot, and wafer transfer apparatus
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Application No.: US16813011Application Date: 2020-03-09
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Publication No.: US11437257B2Publication Date: 2022-09-06
- Inventor: Yoshiaki Moriya
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2019-088184 20190508,KR10-2019-0112294 20190910
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/683
Abstract:
A robot hand is provided. The robot hand includes a transfer plate that has a loading region; an electrostatic chuck configured to adsorb a wafer disposed on the loading region of the transfer plate; and a heating element configured to heat the loading region of the transfer plate.
Information query
IPC分类:
