Invention Grant
- Patent Title: Packaged dies with metal outer layers extending from die back sides toward die front sides
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Application No.: US16920462Application Date: 2020-07-03
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Publication No.: US11437276B2Publication Date: 2022-09-06
- Inventor: Jaynal A Molla , Lakshminarayan Viswanathan , David Abdo , Colby Greg Rampley , Fernando A. Santos
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/3065 ; H01L21/304 ; H01L21/683 ; H01L23/00
Abstract:
A method of wafer dicing includes singulating dies from a semiconductor wafer. The method further includes depositing a metal layer on back sides of the singulated dies, wherein a portion of the metal layer continues beyond the backs sides of the singulated dies to deposit at least partially on lateral sides of the singulated dies. A packaged die includes a semiconductor die and a metal outer layer deposited on the back side of the semiconductor die and on a portion of the lateral side of the semiconductor die nearest the back side. The packaged die further includes a substrate mounted to the back side of the semiconductor die a die attach material that bonds the substrate to the metal outer layer deposited on the semiconductor die, wherein the metal outer layer and the die attach material surround the back edge of the semiconductor die.
Public/Granted literature
- US20200335398A1 PACKAGED DIES WITH METAL OUTER LAYERS EXTENDING FROM DIE BACK SIDES TOWARD DIE FRONT SIDES Public/Granted day:2020-10-22
Information query
IPC分类:
