Invention Grant
- Patent Title: Transistor gates and methods of forming thereof
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Application No.: US16871514Application Date: 2020-05-11
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Publication No.: US11437287B2Publication Date: 2022-09-06
- Inventor: Shih-Yao Lin , Chih-Han Lin , Shu-Uei Jang , Ya-Yi Tsai , Shu-Yuan Ku
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/28 ; H01L27/092 ; H01L29/49 ; H01L29/66

Abstract:
A device includes a semiconductor substrate and a first gate stack over the semiconductor substrate, the first gate stack being between a first gate spacer and a second gate spacer. The device further includes a second gate stack over the semiconductor substrate between the first gate spacer and the second gate spacer and a dielectric material separating the first gate stack from the second gate stack. The dielectric material is at least partially between the first gate spacer and the second gate spacer, a first width of an upper portion of the dielectric material is greater than a second width of a lower portion of the dielectric material, and a third width of an upper portion of the first gate spacer is less than a fourth width of a lower portion of the first gate spacer.
Public/Granted literature
- US20210242093A1 Transistor Gates and Methods of Forming Thereof Public/Granted day:2021-08-05
Information query
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