A semiconductor module includes: semiconductor devices; a resin mold that integrally seals the semiconductor devices; and external terminals that are disposed at a lateral side of the resin mold along a direction perpendicular to a thickness direction of the semiconductor devices. Each semiconductor device includes an insulated gate semiconductor device having a gate electrode, a first electrode, and a second electrode. In the insulated gate semiconductor device, carriers move from the first electrode to the second electrode through a channel provided by a voltage applied to the gate electrode. The external terminals include: a gate terminal electrically connected to the gate electrode; a first terminal electrically connected to the first electrode; and a second terminal electrically connected to the second electrode. The gate terminal and the second terminal, which are electrically connected to an identical semiconductor device, are not adjacent to each other.