Invention Grant
- Patent Title: Method of manufacturing semiconductor devices and corresponding semiconductor device
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Application No.: US16906425Application Date: 2020-06-19
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Publication No.: US11437309B2Publication Date: 2022-09-06
- Inventor: Alberto Arrigoni
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Crowe & Dunlevy
- Priority: IT102019000009585 20190620
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/495
Abstract:
A leadframe for a semiconductor device includes an array of electrically-conductive leads. The electrically-conductive leads have mutually opposed lateral (vertical) surfaces. An electrically-insulating material is formed over the mutually lateral opposed surfaces to prevent short circuits between adjacent leads. The electrically-insulating material may further be provided at one or more of the opposed bottom and top surfaces of the electrically-conductive leads of the leadframe.
Information query
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