Invention Grant
- Patent Title: Electronic device, electronic package and packaging substrate thereof
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Application No.: US16943344Application Date: 2020-07-30
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Publication No.: US11437325B2Publication Date: 2022-09-06
- Inventor: Ho-Chuan Lin , Hsiu-Fang Chien , Chih-Yuan Shih , Tsung-Li Lin
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Kelly & Kelley, LLP
- Priority: TW109116406 20200518
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/528 ; H01L23/00
Abstract:
An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.
Public/Granted literature
- US20210358851A1 ELECTRONIC DEVICE, ELECTRONIC PACKAGE AND PACKAGING SUBSTRATE THEREOF Public/Granted day:2021-11-18
Information query
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