Invention Grant
- Patent Title: Package structure having substrate thermal vent structures for inductor cooling
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Application No.: US16025710Application Date: 2018-07-02
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Publication No.: US11437346B2Publication Date: 2022-09-06
- Inventor: Michael J. Hill , Leigh E. Wojewoda , Mathew Manusharow , Siddharth Kulasekaran
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/34 ; H01L25/065 ; H01L49/02 ; H01F27/08 ; H01L23/64
Abstract:
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.
Public/Granted literature
- US20200006287A1 PACKAGE STRUCTURE HAVING SUBSTRATE THERMAL VENT STRUCTURES FOR INDUCTOR COOLING Public/Granted day:2020-01-02
Information query
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