Invention Grant
- Patent Title: Integrated assemblies having voltage sources coupled to shields and/or plate electrodes through capacitors
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Application No.: US16785942Application Date: 2020-02-10
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Publication No.: US11437381B2Publication Date: 2022-09-06
- Inventor: Jiyun Li , Scott J. Derner
- Applicant: Micron Technology, inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, inc.
- Current Assignee: Micron Technology, inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/522 ; G11C11/408 ; G11C11/4091 ; G11C11/4074

Abstract:
Some embodiments include an integrated assembly having first conductive lines which extend along a first direction, and having second conductive lines over the first conductive lines and which extend along a second direction that crosses the first direction. Capacitors are over the second conductive lines. The second conductive lines are operatively proximate active structures to gatedly couple a first set of the capacitors to the first conductive lines through the active structures. Shield structures are between the first conductive lines and extend along the first direction. A voltage source is electrically coupled to the shield structures through a second set of the capacitors. Some embodiments include assemblies having two or more decks stacked one atop another.
Public/Granted literature
Information query
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