Invention Grant
- Patent Title: Stack capacitor, a flash memory device and a manufacturing method thereof
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Application No.: US17213885Application Date: 2021-03-26
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Publication No.: US11437387B2Publication Date: 2022-09-06
- Inventor: Zhi Tian , Juanjuan Li , Hua Shao , Haoyu Chen
- Applicant: SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Current Assignee: SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Current Assignee Address: CN Shanghai
- Agency: Alston & Bird LLP
- Priority: CN202010224926.4 20200326
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/11536 ; H01L27/06 ; H01L27/11539 ; H01L49/02 ; H01L29/66 ; H01L29/788

Abstract:
The present disclosure provides a stack capacitor, a flash memory device, and a manufacturing method thereof. The stack capacitor of the flash memory device has a a memory transistor structure which at least comprises a substrate, and a tunneling oxide layer, a floating gate layer, an interlayer dielectric layer and a control gate layer which are sequentially stacked on the substrate, the interlayer dielectric layer of the stack capacitor comprises a first oxide layer and a nitride layer; the stack capacitor further comprises a first contact leading out of the control gate layer and a second contact leading out of the floating gate layer. The capacitance per unit area of the stack capacitor provided by the disclosure is effectively improved, and the size of the transistor device is reduced. The manufacturing method according to the disclosure does not add any additional photomask than a conventional process flow.
Public/Granted literature
- US20210305265A1 STACK CAPACITOR, A FLASH MEMORY DEVICE AND A MANUFACTURING METHOD THEREOF Public/Granted day:2021-09-30
Information query
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