Invention Grant
- Patent Title: Array substrate and manufacturing method thereof, and display device
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Application No.: US16335085Application Date: 2018-08-20
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Publication No.: US11437409B2Publication Date: 2022-09-06
- Inventor: Seungjin Choi
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Banner & Witcoff, Ltd.
- Priority: CN201711105473.8 20171110
- International Application: PCT/CN2018/101373 WO 20180820
- International Announcement: WO2019/091182 WO 20190516
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1362 ; G02F1/136 ; G02F1/1368 ; G02F1/1343

Abstract:
An array substrate and a manufacturing method thereof, and a display device. The array substrate includes: a base substrate, including a first surface and a second surface opposite to each other, and a through-hole penetrating the base substrate from the first surface to the second surface; a data line on the first surface of the base substrate, the data line being at least partially filled in the through-hole; a thin film transistor on the second surface of the base substrate, the thin film transistor including a source electrode and a drain electrode, and the source electrode being electrically connected to the data line.
Public/Granted literature
- US20210351203A1 Array Substrate and Manufacturing Method Thereof, and Display Device Public/Granted day:2021-11-11
Information query
IPC分类: