Invention Grant
- Patent Title: Power semiconductor device
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Application No.: US17118693Application Date: 2020-12-11
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Publication No.: US11437471B2Publication Date: 2022-09-06
- Inventor: Roman Baburske , Moritz Hauf , Hans-Joachim Schulze , Holger Schulze , Benedikt Stoib
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102019135545.1 20191220
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L27/06 ; H01L29/06 ; H01L29/78 ; H01L29/739 ; H01L29/861 ; H01L29/10

Abstract:
A power semiconductor device includes: a semiconductor body; a first load terminal structure coupled to the body front side and a second load terminal structure coupled to the body backside; an active area for conducting a load current between the load terminal structures; a drift region having a first conductivity type; a backside region arranged at the backside and including, inside the active area, first and second backside emitter zones. At least one of the backside emitter zones includes: first sectors each having at least one first region of a second conductivity type, the first region arranged in contact with the second load terminal structure and having a smallest lateral extension of at most 50 μm; and/or second sectors each having a second region of the second conductivity type arranged in contact with the second load terminal structure and having a smallest lateral extension of at least 50 μm.
Public/Granted literature
- US20210193800A1 Power Semiconductor Device Public/Granted day:2021-06-24
Information query
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