Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US17157180Application Date: 2021-01-25
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Publication No.: US11437495B2Publication Date: 2022-09-06
- Inventor: I-Chih Chen , Ru-Shang Hsiao , Ching-Pin Lin , Chih-Mu Huang , Fu-Tsun Tsai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Duane Morris LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/088 ; H01L21/8234 ; H01L29/423

Abstract:
A semiconductor device includes: first and second fin structures, disposed on a substrate, that respectively extend in parallel to an axis; a first gate feature that traverses the first fin structure to overlay a central portion of the first fin structure; a second gate feature that traverses the second fin structure to overlay a central portion of the second fin structure; a first spacer comprising: a first portion comprising two layers that respectively extend from sidewalls of the first gate feature toward opposite directions of the axis; and a second portion comprising two layers that respectively extend from sidewalls of the first portion of the first spacer toward the opposite directions of the axis; and a second spacer comprising two layers that respectively extend from sidewalls of the second gate feature toward the opposite directions of the axis.
Public/Granted literature
- US20210210616A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-07-08
Information query
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