Invention Grant
- Patent Title: Trench MOSFET and method of manufacturing trench MOSFET
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Application No.: US17253597Application Date: 2019-12-27
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Publication No.: US11437510B2Publication Date: 2022-09-06
- Inventor: Xuan Xiao , Jun Ye , Jie Li
- Applicant: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
- Current Assignee: WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.
- Current Assignee Address: CN Jiangsu
- Agency: McCoy Russell LLP
- Priority: CN201811607412.6 20181227
- International Application: PCT/CN2019/129261 WO 20191227
- International Announcement: WO2020/135735 WO 20200702
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/765 ; H01L29/06 ; H01L29/10 ; H01L29/40 ; H01L29/66

Abstract:
The present disclosure discloses a trench MOSFET and a method of manufacturing trench MOSFET. The trench MOSFET includes a substrate, an epitaxial layer, a plurality of trenches, and body region; the substrate has a first conductivity type; the epitaxial layer has the first conductivity type; the plurality of trenches are formed in the epitaxial layer, and at least two of the plurality of trenches are communicated with each other a gate structure is provided in the trench; the body region has a second conductivity type and has a second conductivity type and is disposed among the plurality of trenches.
Public/Granted literature
- US20210273092A1 TRENCH MOSFET AND METHOD OF MANUFACTURING TRENCH MOSFET Public/Granted day:2021-09-02
Information query
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