Invention Grant
- Patent Title: Multi-gate device and method of fabrication thereof
-
Application No.: US16722905Application Date: 2019-12-20
-
Publication No.: US11437513B2Publication Date: 2022-09-06
- Inventor: Kuo-Cheng Ching , Ching-Wei Tsai , Carlos H. Diaz , Chih-Hao Wang , Wai-Yi Lien , Ying-Keung Leung
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/775 ; H01L29/165 ; H01L29/06 ; H01L29/423 ; H01L29/786

Abstract:
A multi-gate semiconductor device is formed that provides a first fin element extending from a substrate. A gate structure extends over a channel region of the first fin element. The channel region of the first fin element includes a plurality of channel semiconductor layers each surrounded by a portion of the gate structure. A source/drain region of the first fin element is adjacent the gate structure. The source/drain region includes a first semiconductor layer, a dielectric layer over the first semiconductor layer, and a second semiconductor layer over the dielectric layer.
Public/Granted literature
- US20200152794A1 MULTI-GATE DEVICE AND METHOD OF FABRICATION THEREOF Public/Granted day:2020-05-14
Information query
IPC分类: