Invention Grant
- Patent Title: Mechanisms for growing epitaxy structure of finFET device
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Application No.: US15381270Application Date: 2016-12-16
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Publication No.: US11437516B2Publication Date: 2022-09-06
- Inventor: Szu-Chi Yang , Chih-Hsiang Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/8234 ; H01L21/8238 ; H01L29/66 ; H01L29/08 ; H01L29/165

Abstract:
A semiconductor structure includes a gate structure disposed over a substrate, and a plurality of source/drain features disposed on the substrate and interposed by the gate structure. Each of the source/drain features includes a first doped source/drain region extended away from the substrate, and a second doped source/drain region disposed on top and side surfaces of the first doped source/drain region, in which a phosphorus doping concentration of the first doped source/drain region is lower than a doping concentration of the second doped source/drain region.
Public/Granted literature
- US20180151737A1 MECHANISMS FOR GROWING EPITAXY STRUCTURE OF FINFET DEVICE Public/Granted day:2018-05-31
Information query
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