Invention Grant
- Patent Title: Semiconductor device with transmissive layer and manufacturing method thereof
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Application No.: US17026752Application Date: 2020-09-21
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Publication No.: US11437552B2Publication Date: 2022-09-06
- Inventor: David Clark , Curtis Zwenger
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L21/56 ; H01L23/00 ; H01L21/683 ; H01L33/44 ; H01L33/62
Abstract:
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.
Public/Granted literature
- US20210020813A1 SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-01-21
Information query
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