Invention Grant
- Patent Title: Hall sensor structure
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Application No.: US16877120Application Date: 2020-05-18
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Publication No.: US11437569B2Publication Date: 2022-09-06
- Inventor: Maria-Cristina Vecchi , Reinhard Erwe , Martin Cornils , Kerwin Khu
- Applicant: TDK-Micronas GmbH
- Applicant Address: DE Freiburg
- Assignee: TDK-Micronas GmbH
- Current Assignee: TDK-Micronas GmbH
- Current Assignee Address: DE Freiburg
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: DE102019003481.3 20190516
- Main IPC: G01R33/07
- IPC: G01R33/07 ; H01L43/06 ; H01L43/04

Abstract:
A Hall sensor structure comprising a semiconductor body of a first conductivity type, a well region of a second conductivity type extending from a top side of the semiconductor body into the semiconductor body, at least three first semiconductor contact regions of the second conductivity type, each extending from a top side of the well region into the well region, at least one second semiconductor contact region of a second conductivity type, wherein the first semiconductor contact regions are spaced apart from one another and from an edge of the well region, a metallic connection contact layer is arranged on each first semiconductor contact region, the at least one second semiconductor contact region extends along the top side of the semiconductor body at least partially around the well region.
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