Invention Grant
- Patent Title: Antenna module
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Application No.: US16925847Application Date: 2020-07-10
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Publication No.: US11437724B2Publication Date: 2022-09-06
- Inventor: Tae Hong Min
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0036013 20200325
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01Q9/04 ; H01L25/18 ; H01L23/498 ; H01Q1/52 ; H01L23/66 ; H01L23/552
Abstract:
An antenna module includes: a wiring structure including a plurality of insulating layers and a plurality of wiring layers; a metal structure disposed on one surface of the wiring structure, and having a through-portion; and an antenna disposed on the one surface of the wiring structure. At least a portion of the antenna is disposed in the through-portion.
Public/Granted literature
- US20210305699A1 ANTENNA MODULE Public/Granted day:2021-09-30
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