Invention Grant
- Patent Title: Connector pre-filled with sealant
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Application No.: US16955543Application Date: 2018-12-04
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Publication No.: US11437739B2Publication Date: 2022-09-06
- Inventor: Tetsuya Hata , Shigeki Ohara
- Applicant: KYOCERA CORPORATION
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Duane Morris LLP
- Priority: JPJP2017-246961 20171222
- International Application: PCT/JP2018/044623 WO 20181204
- International Announcement: WO2019/124064 WO 20190627
- Main IPC: H01R13/52
- IPC: H01R13/52 ; H01R4/2456 ; H01R4/70

Abstract:
A connector (10) configured to bring an object (70) into conduction comprises: a pair of fitting bodies fittable to each other; and a filler (60) with which at least one fitting body of the pair of fitting bodies is loaded, wherein a fitting body of the pair of fitting bodies includes: an accommodating portion (35a) configured to accommodate the object (70) together with the filler (60); and a receiving portion (36) configured to be adjacent to the accommodating portion (35a) and receive the filler (60).
Public/Granted literature
- US20210098899A1 CONNECTOR Public/Granted day:2021-04-01
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