Invention Grant
- Patent Title: Distributed feedback (DFB) laser on silicon and integrated device comprising a DFB laser on silicon
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Application No.: US16803668Application Date: 2020-02-27
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Publication No.: US11437781B2Publication Date: 2022-09-06
- Inventor: Gengming Tao , Bin Yang , Xia Li
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza, LLP/Qualcomm
- Main IPC: H01S5/12
- IPC: H01S5/12 ; H01S5/02 ; H01S5/026 ; H01S5/343 ; H01S5/042 ; H01S5/34

Abstract:
A distributed feedback (DFB) laser that includes a substrate comprising a first surface and a second surface, wherein the substrate comprises silicon; a plurality of shallow trench isolations (STIs) located over the second surface of the substrate; a grating region located over the plurality of STIs and the substrate, wherein the grating region comprises a III-V semiconductor material; a non-intentional doping (NID) region located over the grating region; and a contact region located over the NID region.
Public/Granted literature
- US20210273409A1 DISTRIBUTED FEEDBACK (DFB) LASER ON SILICON AND INTEGRATED DEVICE COMPRISING A DFB LASER ON SILICON Public/Granted day:2021-09-02
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