Invention Grant
- Patent Title: Component carrier and method of manufacturing the same
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Application No.: US17247884Application Date: 2020-12-29
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Publication No.: US11439018B2Publication Date: 2022-09-06
- Inventor: Sabine Liebfahrt , Ferdinand Lutschounig , Bernhard Reitmaier , Julia Platzer , Markus Frewein
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/18 ; H05K3/46
Abstract:
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.
Public/Granted literature
- US20220210920A1 COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-06-30
Information query
