Invention Grant
- Patent Title: Method for forming circuit
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Application No.: US16301076Application Date: 2016-06-08
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Publication No.: US11439025B2Publication Date: 2022-09-06
- Inventor: Yoshitaka Hashimoto , Masatoshi Fujita , Kenji Tsukada , Akihiro Kawajiri , Masato Suzuki , Katsuaki Makihara
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2016/067045 WO 20160608
- International Announcement: WO2017/212567 WO 20171214
- Main IPC: H05K3/28
- IPC: H05K3/28 ; H05K3/12 ; H05K3/30 ; H05K3/32 ; H05K1/18 ; H05K3/00
Abstract:
In a circuit forming device, a resin laminated body is formed by curing an ultraviolet curable resin ejected by an ejecting device. Then, ultraviolet curable resin is ejected into a cavity of the resin laminated body, and an electronic component is placed on the ultraviolet curable resin. Then, the electronic component is cured and the electronic component is fixed.
Public/Granted literature
- US20200163217A1 METHOD FOR FORMING CIRCUIT Public/Granted day:2020-05-21
Information query
