Invention Grant
- Patent Title: Grounding detection device and electronic component mounter
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Application No.: US16772926Application Date: 2018-01-10
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Publication No.: US11439051B2Publication Date: 2022-09-06
- Inventor: Kenzo Ishikawa
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2018/000351 WO 20180110
- International Announcement: WO2019/138474 WO 20190718
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/08 ; H05K13/04

Abstract:
A grounding includes a photoelectric sensor that emits light to a detection region in which the detection target portion moves in conjunction with the grounding of the electronic component to a board and receives light from the detection region, and a grounding discrimination section that discriminates between the presence or absence of the grounding based on a signal from the photoelectric sensor. The detection target portion is disposed in the detection region in the ungrounded state.
Public/Granted literature
- US20200329597A1 GROUNDING DETECTION DEVICE AND ELECTRONIC COMPONENT MOUNTER Public/Granted day:2020-10-15
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