Invention Grant
- Patent Title: Method for manufacturing copper powder, resin composition, method for forming cured product, and cured product
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Application No.: US16484268Application Date: 2017-12-07
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Publication No.: US11440092B2Publication Date: 2022-09-13
- Inventor: Yusuke Nuida , Hiroshi Morita
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JPJP2017-043787 20170308
- International Application: PCT/JP2017/043985 WO 20171207
- International Announcement: WO2018/163543 WO 20180913
- Main IPC: B22F9/24
- IPC: B22F9/24 ; B22F1/102 ; C08L57/00 ; C08L61/04 ; C08L67/00 ; C08J7/044 ; C08K3/08

Abstract:
A method of manufacturing copper powder according to the present invention includes: a first step of reducing copper particles in water by using at least one compound selected from the group consisting of potassium borohydride, sodiumborohydride, and lithium borohydride; after the first step, a second step of washing with water; a third step of washing copper powder obtained in the second step with at least one compound selected from the group consisting of ether compounds and alcohol compounds; and a fourth step of bringing the copper powder obtained in the third step into contact with an organic acid solution, in which at least one compound selected from the group consisting of ether compounds and alcohol compounds is used as a solvent.
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