Invention Grant
- Patent Title: Alternative compositions for high temperature soldering applications
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Application No.: US15109115Application Date: 2014-01-16
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Publication No.: US11440142B2Publication Date: 2022-09-13
- Inventor: Catherine A Shearer
- Applicant: Ormet Circuits, Inc.
- Applicant Address: US CA San Diego
- Assignee: Ormet Circuits, Inc.
- Current Assignee: Ormet Circuits, Inc.
- Current Assignee Address: US CA San Diego
- Agent Mitchell Brustein
- International Application: PCT/US2013/074497 WO 20140116
- International Announcement: WO2014/082100 WO 20140530
- Main IPC: B23K35/26
- IPC: B23K35/26 ; B23K35/30 ; B23K35/02 ; H05K3/34 ; H01L23/00 ; B23K35/36 ; B23K35/362
Abstract:
Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.
Public/Granted literature
- US20160368103A1 ALTERNATIVE COMPOSITIONS FOR HIGH TEMPERATURE SOLDERING APPLICATIONS Public/Granted day:2016-12-22
Information query
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