Invention Grant
- Patent Title: Temperature control device
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Application No.: US16565904Application Date: 2019-09-10
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Publication No.: US11440228B2Publication Date: 2022-09-13
- Inventor: Jun Kudamatsu
- Applicant: MATSUI MFG. CO., LTD.
- Applicant Address: JP Osaka
- Assignee: MATSUI MFG. CO., LTD.
- Current Assignee: MATSUI MFG. CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Bozicevic, Field & Francis LLP
- Agent Bret E. Field
- Priority: JPJP2018-175291 20180919
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B29C45/03 ; B29C45/78 ; B29C35/00

Abstract:
A temperature control device is provided that is capable of making the temperature of a metallic mold speedily reach a target temperature.
The temperature control device is provided with: a first medium circulating portion that circulates a medium via a first pipeline; a second medium circulating portion that circulates the medium via a second pipeline; a third medium circulating portion that circulates the medium via a third pipeline; a switching portion that switches the medium circulated through an object by selecting any one of the first pipeline, the second pipeline and the third pipeline; and a pressure supply portion that supplies a required pressure through a pressure pipe communicating with each of the first pipeline, the second pipeline and the third pipeline.
The temperature control device is provided with: a first medium circulating portion that circulates a medium via a first pipeline; a second medium circulating portion that circulates the medium via a second pipeline; a third medium circulating portion that circulates the medium via a third pipeline; a switching portion that switches the medium circulated through an object by selecting any one of the first pipeline, the second pipeline and the third pipeline; and a pressure supply portion that supplies a required pressure through a pressure pipe communicating with each of the first pipeline, the second pipeline and the third pipeline.
Public/Granted literature
- US20200086544A1 Temperature Control Device Public/Granted day:2020-03-19
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