- Patent Title: Solder mask inkjet inks for manufacturing printed circuit boards
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Application No.: US16954588Application Date: 2018-12-10
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Publication No.: US11441046B2Publication Date: 2022-09-13
- Inventor: Christopher Wall , Clive Landells
- Applicant: AGFA-GEVAERT NV , ELECTRA POLYMER LTD.
- Applicant Address: BE Mortsel; GB Tonbridge
- Assignee: AGFA-GEVAERT NV,ELECTRA POLYMER LTD.
- Current Assignee: AGFA-GEVAERT NV,ELECTRA POLYMER LTD.
- Current Assignee Address: BE Mortsel; GB Tonbridge
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: EP17208239 20171218
- International Application: PCT/EP2018/084134 WO 20181210
- International Announcement: WO2019/121093 WO 20190627
- Main IPC: C09D11/38
- IPC: C09D11/38 ; C08F220/28 ; C08F2/50 ; C08F220/32 ; C08K5/11 ; C08K5/45 ; C09D11/36 ; H05K3/34 ; B41M7/00
Abstract:
A method of manufacturing an electronic device includes preparing a solder mask with a radiation curable solder mask inkjet ink containing at least one cationic polymerizable compound and a photoinitiating system, wherein the photoinitiating system includes a specified sulphonium compound and a thioxanthone.
Public/Granted literature
- US20200332141A1 SOLDER MASK INKJET INKS FOR MANUFACTURING PRINTED CIRCUIT BOARDS Public/Granted day:2020-10-22
Information query
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