Invention Grant
- Patent Title: System for analyzing impact and puncture resistance
-
Application No.: US16630740Application Date: 2018-04-30
-
Publication No.: US11441985B2Publication Date: 2022-09-13
- Inventor: Donald L. McCarty, II , Erick Sutanto , John Lund , Brayden E. Glad , Hitendra Singh
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland; US PA Collegeville
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland; US PA Collegeville
- Agency: Dinsmore & Shohl LLP
- International Application: PCT/US2018/030298 WO 20180430
- International Announcement: WO2019/027522 WO 20190207
- Main IPC: G01N3/42
- IPC: G01N3/42

Abstract:
A method and a system for analyzing a physical characteristic of a film sample are described herein. The system includes a material holder system configured to hold the film sample; a dart testing system configured to test a physical characteristic of the film sample; and a moving system configured to move the held film sample to be analyzed or tested between stations. The moving system is configured to move the held film sample in the material holder system to the dart testing system.
Public/Granted literature
- US20210131933A1 SYSTEM FOR ANALYZING IMPACT AND PUNCTURE RESISTANCE Public/Granted day:2021-05-06
Information query