Disclosed are a pipette type patch clamp, a measuring device having the patch clamp, and a method of manufacturing the patch clamp. The pipette type patch clamp includes a pipette type puller having a through region with a predetermined length such that an object is sucked therethrough, a silicon wafer configured to support the puller, an insulating layer disposed on a surface of the silicon wafer and a surface of the puller, and an electrode layer disposed on a surface of the insulating layer to connect to a first fluid channel and a second fluid channel.