Invention Grant
- Patent Title: Wiring structure, fuser device, and image forming apparatus
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Application No.: US16507260Application Date: 2019-07-10
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Publication No.: US11442384B2Publication Date: 2022-09-13
- Inventor: Shanying Pan , Takayuki Masunaga
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Maier & Maier, PLLC
- Priority: JPJP2018-167726 20180907
- Main IPC: G03G15/20
- IPC: G03G15/20 ; H05K1/02

Abstract:
According to one embodiment, a wiring structure includes a substrate, a first conductor, second conductors, a first trace, second traces, heat-generating elements, and a first protruding conductor. The second conductors are spaced apart from the first conductor in a second direction crossing a first direction and are mutually juxtaposed with spacing in the first direction. The heat-generating elements are mutually juxtaposed in the first direction and connected to the respective second conductors and the first conductor. The first protruding conductor protrudes from either of the first conductor and one of the second conductors and is connected to a first one of the heat-generating elements. The first protruding conductor is at least partly located, in the first direction, between a center of the first one of the heat-Generating elements and a center of a second one of the heat-generating elements adjacent to the first one.
Public/Granted literature
- US20200081380A1 WIRING STRUCTURE, FUSER DEVICE, AND IMAGE FORMING APPARATUS Public/Granted day:2020-03-12
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