Invention Grant
- Patent Title: Three-dimensional (3D) integrated circuit device having a backside power delivery network
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Application No.: US16928939Application Date: 2020-07-14
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Publication No.: US11444068B2Publication Date: 2022-09-13
- Inventor: Stanley Seungchul Song , Jonghae Kim , Periannan Chidambaram , Pratyush Kamal
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L25/00 ; H01L23/00 ; H01L21/762 ; H01L21/48
Abstract:
An integrated circuit (IC) package is described. The IC package includes a power delivery network. The IC package also includes a first die having a first surface and a second surface, opposite the first surface. The second surface is on a first surface of the power delivery network. The IC package further includes a second die having a first surface on the first surface of the first die. The IC package also includes package bumps on a second surface of the power delivery network, opposite the first surface of the power delivery network. The package bumps are coupled to contact pads of the power delivery network.
Public/Granted literature
- US20220020735A1 THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT DEVICE HAVING A BACKSIDE POWER DELIVERY NETWORK Public/Granted day:2022-01-20
Information query
IPC分类:
