A laser cutting apparatus and method, and a method of manufacturing a display panel by using a laser cutting method are provided. A laser cutting method includes: providing a panel in which a second substrate is stacked on a first substrate including a conductive wiring; and removing a portion of the second substrate to expose the conductive wiring by emitting a laser beam to the second substrate, and the laser beam is emitted to the second substrate at an incident angle equal to or greater than a threshold angle at which total reflection occurs in the second substrate.