Invention Grant
- Patent Title: Ductile one-component thermosetting epoxy composition
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Application No.: US17208732Application Date: 2021-03-22
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Publication No.: US11447599B2Publication Date: 2022-09-20
- Inventor: Nicolae Bordeanu , Leslie Wolschleger
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP20164711 20200320
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08G59/40 ; C08J9/10 ; C08L13/00

Abstract:
A one-component thermosetting epoxy resin composition, including a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins; c) at least one physical or chemical blowing agent BA; d) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR1 with a Mooney Viscosity of 15-30 MU (Mooney units), based on the total amount of epoxy resin A; and e) 3-15 wt.-% of at least one carboxyl group containing acrylonitrile/butadiene rubber ABR2 with a Mooney Viscosity of 35-50 MU (Mooney units), based on the total amount of epoxy resin A. The ratio of ABR1 to ABR2 is from 0.5-2.0. The epoxy resin adhesive is notable for the improved storage stability.
Public/Granted literature
- US20210292470A1 DUCTILE ONE-COMPONENT THERMOSETTING EPOXY COMPOSITION Public/Granted day:2021-09-23
Information query
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