Invention Grant
- Patent Title: Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
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Application No.: US17621918Application Date: 2020-06-26
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Publication No.: US11447658B2Publication Date: 2022-09-20
- Inventor: Shunsuke Katagiri , Takuya Suzuki , Seiji Shika , Yune Kumazawa
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P L C.
- Priority: JPJP2019-122162 20190628
- International Application: PCT/JP2020/025142 WO 20200626
- International Announcement: WO2020/262580 WO 20201230
- Main IPC: C08G73/12
- IPC: C08G73/12 ; C09D179/08 ; B32B27/08 ; B32B27/36 ; H05K1/03 ; H01L23/29

Abstract:
The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a photo initiator (B) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line). In the formula (1), R1, R2, and R3 each independently represent an alkyl group or an alkoxy group which may have a hydrogen atom, a halogen atom, a hydroxyl group, or a substituent, R4 represents an alkylene group, an alkenylene group, an alkoxylene group, or an arylene group which may have a substituent, and R5 and R6 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 6 carbon atoms, or a linear or branched alkenyl group having 1 to 6 carbon atoms.
Public/Granted literature
- US20220204810A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE Public/Granted day:2022-06-30
Information query
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