Invention Grant
- Patent Title: Thermal interface material with mixed aspect ratio particle dispersions
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Application No.: US16437411Application Date: 2019-06-11
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Publication No.: US11447677B2Publication Date: 2022-09-20
- Inventor: John Timmerman , Sanjay Misra
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Steven C. Bauman
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/04 ; C08K3/22 ; C08K3/38 ; H01L23/373 ; C08K7/04 ; C08K7/18

Abstract:
An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
Public/Granted literature
- US20190322918A1 Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions Public/Granted day:2019-10-24
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