Invention Grant
- Patent Title: Heat dissipation plate and method for manufacturing the same
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Application No.: US17412164Application Date: 2021-08-25
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Publication No.: US11448470B2Publication Date: 2022-09-20
- Inventor: Wei-Lung Chan , Wen-Ti Cheng
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: McDermott Will & Emery LLP
- Main IPC: F28D15/04
- IPC: F28D15/04 ; F28F3/12 ; B21D53/04 ; F28F3/14 ; B23P15/26 ; F28D15/02 ; B23K101/14 ; B21D39/03
Abstract:
A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.
Public/Granted literature
- US20210381775A1 HEAT DISSIPATION PLATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2021-12-09
Information query
