Invention Grant
- Patent Title: Sensor component, sensor, and method for manufacturing sensor
-
Application No.: US16335895Application Date: 2017-09-15
-
Publication No.: US11448531B2Publication Date: 2022-09-20
- Inventor: Hironobu Yamamoto , Kyungwoo Kim , Toshinari Kobayashi , Masaharu Nakamura
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Mie
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Mie
- Agency: Honigman LLP
- Priority: JPJP2016-186564 20160926,JPJP2017-134378 20170710
- International Application: PCT/JP2017/033520 WO 20170915
- International Announcement: WO2018/056217 WO 20180329
- Main IPC: G01D11/24
- IPC: G01D11/24 ; G01P1/02 ; G01P3/44

Abstract:
A sensor component includes: a sensor part having a sensor body and a connection terminal extending from the sensor body; and a holder part for holding the sensor part, the connection terminal being resin-sealed by an exterior part that is connected to a conductor of a wire, wherein a melt part that melts during the molding of the exterior part is provided on an outer surface of the holder part that is arranged inside of the exterior part, and the melt part is arranged in a position separating the sensor body and a connection part where the connection terminal is connected to the conductor.
Public/Granted literature
- US20200292361A1 SENSOR COMPONENT, SENSOR, AND METHOD FOR MANUFACTURING SENSOR Public/Granted day:2020-09-17
Information query