Invention Grant
- Patent Title: Sensor and sensor module
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Application No.: US17183022Application Date: 2021-02-23
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Publication No.: US11448628B2Publication Date: 2022-09-20
- Inventor: Naoki Hiramatsu , Yosuke Akimoto , Hiroaki Yamazaki , Yumi Hayashi
- Applicant: KABUSHIKI KAISHA TOSHIBA
- Applicant Address: JP Tokyo
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner L.L.P.
- Priority: JPJP2020-122799 20200717
- Main IPC: G01N27/22
- IPC: G01N27/22 ; G01N33/00 ; G01N27/18 ; G01N27/04

Abstract:
According to one embodiment, a sensor includes a base body, and a first sensor part. The first sensor part includes fixed and movable electrode members, and first and second support members. The fixed electrode member includes a fixed electrode fixed to the base body. The movable electrode member includes a movable electrode. The movable electrode member includes first and second movable portions, and a third movable portion between the first and second movable portions. The first support member is fixed to the base body and connected with the first movable portion. The second support member is fixed to the base body and connected with the second movable portion. The first and second support members support the movable electrode member to provide a first gap between the fixed and movable electrode members. The fixed electrode member includes first, second, and third fixed electrode portions facing the movable portion.
Public/Granted literature
- US20220018820A1 SENSOR AND SENSOR MODULE Public/Granted day:2022-01-20
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