Invention Grant
- Patent Title: Semiconductor device and method of compartment shielding using bond wires
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Application No.: US17032005Application Date: 2020-09-25
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Publication No.: US11450618B2Publication Date: 2022-09-20
- Inventor: YoungCheol Kim , ChoonHeung Lee , WonGyou Kim
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/552 ; H01L23/31 ; H01L21/56 ; H01L23/498 ; H01L23/00 ; H01L21/48 ; H01L23/49

Abstract:
A semiconductor device has a substrate and a plurality of bond wires is disposed in a pattern across on the substrate. The pattern of bond wires can be a plurality of rows of bond wires. A plurality of electrical components is disposed over the substrate as an SIP module. An encapsulant is deposited over the substrate, electrical components, and bond wire. An opening is formed in the encapsulant extending to the bond wire. The opening can be a trench extending across the bond wires disposed on the substrate, or a plurality of openings individually exposing each of a plurality of bond wires. A conductive material is disposed in the opening. A shielding layer is formed over the encapsulant and in contact with the conductive material. The shielding layer, conductive material, and bond wires reduce the effects of EMI, RFI, and other inter-device interference.
Public/Granted literature
- US20210225778A1 Semiconductor Device and Method of Compartment Shielding Using Bond Wires Public/Granted day:2021-07-22
Information query
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