Invention Grant
- Patent Title: High density 3D FERAM
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Application No.: US17106516Application Date: 2020-11-30
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Publication No.: US11450686B2Publication Date: 2022-09-20
- Inventor: Sai-Hooi Yeong , Bo-Feng Young , Yu-Ming Lin , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/11597
- IPC: H01L27/11597 ; H01L27/11587 ; H01L29/78 ; H01L21/28 ; H01L27/1159 ; H01L27/11585 ; H01L29/786

Abstract:
A device includes a first channel; a second channel above the first channel; and a gate structure surrounding the first and second channels, wherein the gate structure includes a ferroelectric (FE) layer surrounding the first and second channels and a gate metal layer surrounding the FE layer. The device further includes two first electrodes connected to two sides of the first channel; two second electrodes connected to two sides of the second channel; a dielectric layer between the first and the second electrodes; and an inner spacer layer between the two first electrodes and the gate structure.
Public/Granted literature
- US20210408043A1 HIGH DENSITY 3D FERAM Public/Granted day:2021-12-30
Information query
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