Invention Grant
- Patent Title: Electronic semiconducting device, method for preparing the electronic semiconducting device and compound
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Application No.: US16485824Application Date: 2018-02-16
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Publication No.: US11450829B2Publication Date: 2022-09-20
- Inventor: Ulrich Heggemann , Markus Hummert
- Applicant: Novaled GmbH
- Applicant Address: DE Dresden
- Assignee: Novaled GmbH
- Current Assignee: Novaled GmbH
- Current Assignee Address: DE Dresden
- Agency: Eversheds Sutherland (US) LLP
- Priority: EP17156902 20170220,EP17156904 20170220,EP17156906 20170220
- International Application: PCT/EP2018/053954 WO 20180216
- International Announcement: WO2018/150006 WO 20180823
- Main IPC: H01L51/50
- IPC: H01L51/50 ; C07F3/02 ; C07F3/06 ; H01L27/32 ; H01L51/00 ; H01L51/56 ; C07F5/02 ; C09K11/06 ; H01L51/42

Abstract:
The present invention relates to an electronic device comprising between a first electrode and a second electrode at least one first semiconducting layer comprising: (i) at least one first hole transport matrix compound consisting of covalently bound atoms and (ii) at least one electrical p-dopant selected from metal borate complexes, wherein the metal borate complex consists of at least one metal cation and at least one anionic ligand consisting of at least six covalently bound atoms which comprises at least one boron atom, wherein the first semiconducting layer is a hole injection layer, a hole-injecting part of a charge generating layer or a hole transport layer, a method for preparing the same and a respective metal borate compound.
Public/Granted literature
- US11539014B2 Electronic semiconducting device, method for preparing the electronic semiconducting device and compound Public/Granted day:2022-12-27
Information query
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