An all-fiber airtight packaging structure with semiconductor saturable absorber mirror includes a ceramic optical fiber ferrule connector, a SESAM, a SESAM fixed block, a TEC chilling plate, a sealing shell, and a cover plate. The cover plate seals the sealing shell by connecting to a sealing shell surface. The TEC chilling plate and the SESAM fixed block are set in the sealing shell. The SESAM fixed block is located above the TEC chilling plate. The SESAM is pasted on the SESAM fixed block. A sealing shell central hole is defined in the sealing shell. The ceramic optical fiber ferrule connector is entered into the sealing shell through the sealing shell central hole, and an output end of ceramic optical fiber ferrule connector is opposited to an end of SESAM which is mounted on the SESAM fixed block.